Posts

Conference Preview: Comparing WFD, REACH, EU-RoHS

The revised Waste Framework Directive (WFD) requires the establishment of a database for information on substances of concern in articles as such or in complex objects (products) (SCIP). The goal of this database is to improve the transparency on hazardous substances in articles for waste operators, authorities and consumers. Read more

ECHA SCIP Database Prototype Webinar

On 17th March, ECHA held a webinar where they introdcued the SCIP database prototype. With more than 250 people listening in, the webinar was very well attended. The prototype of the SCIP database was released a month ago to allow duty holders to familiarize themselves with the process of preparing and submitting dossiers in a test environment. Read more

Fraunhofer IZM Working Group “Legally Compliant Environmental Management”

At a working group meeting of the working group “legally compliant environmental management”, Andreas Müller presented on the ECHA SCIP Database. As the opesus expert on the upcoming SCIP requirements, Andreas covered the regulatory requirements and included tips on how companies can start preparing for the upcoming deadline. Read more

SCIP Format Support with opesus EHSM Smart Input

Get ready for SCIP! The opesus EHSM Smart Input (ESI) now supports the new SCIP format. This means you can start to prepare for SCIP requirements by importing the REACH SVHC Candidate List in ESI. Read more

Software for Creating SCIP Notifications

Under the Waste Framework Directive (WFD), the European Chemicals Agency (ECHA) has developed the SCIP Database designed to capture information on articles containing substances of very high concern (SVHCs) on the REACH Candidate List. This requirement of submitting information poses a significant challenge to companies to efficiently comply with their reporting obligations. We are excited to announce that our software, opesus EHS Product Notification, will support companies that are required to submit notifications to the SCIP database. Read more